磁性元件廠聯寶 (6821-TW) 表示,隨 5G FWA 市場滲透率提升,Wi-Fi 7、DOCSIS 4.0 等網通升級規格需求,均有助帶動磁性元件業務動能,第二季審慎樂觀,公司也計畫擴增台灣土城新廠辦,強化中長期動能。
以磁性元件起家的聯寶電子,近幾年來除深耕既有網通領域外,更進一步跨入車用領域,以及切入智控模組及無線充電,並持續研發新品,以搶攻相關升級商機,究竟這家上櫃僅2年的公司,如何找到利基、跟著產品升級的趨勢成長,跟著DJ Café一起來了解!
聯寶電子股份有限公司(以下簡稱”聯寶”,股票代號6821)公布2025年4月合併營收達7,543萬元,繳出月增40.94%、年增94.11%,創歷史單月新高。累計2025年1月至4月合併營收達2.14億元,較去年同期成長39.24%,亦改寫歷年同期新高水準。
隨著電動車(EV)與重型卡車普及,印第安納州正率先在美國展開一項突破性先導計畫:於西拉法葉(West Lafayette)段的美國231號/52號高速公路,安裝動態無線充電線圈,目標是為行駛中的重型卡車提供高達200 kW的連續供電。
在涼爽宜人的初春時節,聯寶電子職工福利委員會於2025年4月26日,精心規劃了一場「苗栗採果輕旅行一日遊」。本次活動吸引了眾多同仁及家屬熱情參與,大家帶著愉快的心情,迎著晨光一同出發,展開充滿歡笑與驚喜的小旅行。
LinkCom Manufacturing Co., Ltd. (stock code: 6821), a listed company with 36 years of experience in the field of magnetic components, today officially announced its latest technological breakthrough - High-Density Planar Transformer.
Magnetic component manufacturer LinkCom (6821) is actively expanding the application scope of its magnetic components. In addition to its existing presence in the telecom sector, the company is now collaborating with clients to develop humanoid robots. LinkCom revealed that samples in this segment have already been delivered to clients for testing.
台股7日將迎來美國總統川普對全球宣布對等關稅後的首個交易日,各方嚴陣以待潛在的暴跌潮,而休假期間仍有電子廠包括鴻準(2354)、聯寶(6821)、一詮(2486)陸續公布3月營收,隨工作天數回復正常,3月營收強勁成長,其中鴻準在遊戲機組裝訂單進補之下,繳史上最強首季營收成績單。
近期無線電力聯盟(WPC)正式宣布,Qi2 v2.1 標準將納入車載無線充電的移動線圈與磁性對準功能,這不僅標誌著無線充電跨入車用領域的成熟,更為未來車聯網與智慧交通鋪路。
磁性元件廠聯寶公布3月合併營收達5352.3萬元,月增60.9%、年增44.70%,創歷年同期新高;累計第1季合併營收達1.38億元,年增20.6%。
hereinafter referred to as LinkCom Electronics), as a leading supplier of magnetic components and smart module solutions, officially announced that it will participate in the upcoming **Asia Pacific Power & Electronics Exhibition (APEC 2025)** in 2025 and showcase its latest magnetic component technologies and innovative applications at booth **2147**. LinkCom Electronics sincerely invites global customers, partners and investors to visit the booth to experience the company's forward-looking technologies in the fields of AI, electric vehicles and wireless charging, and explore its steady growth investment value.
On March 13, 2025, LinkCom was honored to be invited to participate in the “2025 Spring International Semiconductor Talent Recruitment Event”, jointly organized by CrossBond International and the Office of International Affairs at National Yang Ming Chiao Tung University (NYCU). This event provided a valuable opportunity for LinkCom to engage with outstanding international students studying in Taiwan, furthering industry-academia collaboration and driving talent development in the semiconductor industry.