Linkcom Manufacturing Co., Ltd

On March 13, 2025, LinkCom was honored to be invited to participate in the “2025 Spring International Semiconductor Talent Recruitment Event”, jointly organized by CrossBond International and the Office of International Affairs at National Yang Ming Chiao Tung University (NYCU). This event provided a valuable opportunity for LinkCom to engage with outstanding international students studying in Taiwan, furthering industry-academia collaboration and driving talent development in the semiconductor industry.

Held at the International Conference Hall (B1) of the NYCU Library, the event brought together top international students from around the world currently pursuing their studies in Taiwan. Through corporate sharing sessions, LinkCom introduced its company growth, technological strengths, and future career opportunities, helping students gain deeper insights into semiconductor industry trends and career prospects.

During the event, LinkCom also provided resume reviews and one-on-one interviews, guiding students in refining their job search strategies and enhancing their competitiveness in the job market. In just a few hours, we engaged in meaningful discussions with students from diverse backgrounds, creating a dynamic and rewarding experience for all.

LinkCom has always been committed to cultivating and developing global talent, continuously investing resources to build an innovative and empowering work environment. We sincerely welcome passionate and ambitious professionals to join LinkCom in shaping a future of shared success and self-fulfillment!